Service Hotline +86 400-068-7188
Service Hotline +86 400-068-7188
China Integrated Circuit Encapsulation Industry Market Foresight and Investment Strategy Report, 2013-2017
A must-have for enterprise medium to long-term strategic planning
Without deep industry knowledge, it will be difficult to gain any return
English Version：USD7900
Including: Paper back + Electronic Copy + Invoice
Customer Hotline：+86 755 - 82925195 / 82925295
Free Hotline：+86 400-068-7188After-sales Hotline： +86 755-33013088
The Ministry of Commerce of the People's Republic of China designated Qianzhan Industrial Research Institute as the only "regional workstation for dealing with trade friction" in the Guangdong-Hong Kong-Macao Greater Bay Area
Customer Hotline：+86 755 - 82925195 / 82925295
Free Hotline：+86 400-068-7188
0755 - 82925195
400-068-7188
We are aware of that the content of our products have been stolen by some ones who changed the design and used it to deceive customers as it is their own products. Customers who are misled may experience no product received or an incomplete product.
Therefore, Qianzhan Industrial Research Institute encourage you to arrange an in-person visit to our company before you make the purchase.
Qianzhan has the sole copyright of all research reports. We have never had partnership or affiliated with any third party agent. Please recognize the"
"trademark when purchasing reports.To have better investment return or strategic outcomes, you must have a forward-looking vision. Qianzhan Industrial Research Institute - China's leading industry consulting institutions provide you with all the things you need in business!
* The table of contents and the rest of this report are originally created by Qianzhan. Without any prior written permission, it is prohibited to copy or reproduce in any way. To have better investment return or strategic outcomes, you must have a forward-looking vision!
Table of Contents
Content Summary
Chapter 1: Development Background of China Integrated Circuit Encapsulation Industry
1.1 Definition and Classification of Integrated Circuit Encapsulation Industry
1.1.1 Definition of Integrated Circuit Encapsulation Industry
1.1.2 Product Classification of Integrated Circuit Encapsulation Industry
1.1.3 Analysis of Features of Integrated Circuit Encapsulation Industry
(1) Periodicity of Industry
(2) Regionality of Industry
(3) Seasonality of Industry
1.1.4 Position Analysis of Integrated Circuit Encapsulation Industry in Integrated Circuit Industry
1.2 Analysis of Policy Environment of Integrated Circuit Encapsulation Industry
1.2.1 Industry Management System
1.2.2 Policies Related to the Industry
(1) Planning on Adjusting and Revitalizing the Electronic Information Industry
(2) “Twelfth Five-year” Development Planning for Integrated Circuit Industry
(3) NDRC Accelerating Supporting Efforts on Integrated Circuit Industry
(4) Major Integrated Circuit Special Projects Supported by MOST
(5) Policies on Further Encouraging Development of the Software Industry and Integrated Circuit Industry
(6) Policies and Measurements Related to Encourage the Development of Software Industry and Integrated Circuit Industry by the Customs
1.3 Analysis of Economic Environment of Integrated Circuit Encapsulation Industry
1.3.1 Analysis and Forecast of International Macro-economic Trend
(1) International Macro-economic Status
(2) International Macro-economic Forecast
1.3.2 Analysis and Forecast of Domestic Macro-economic Trend
(1) Analysis of GDP Growth
(2) Analysis of Industrial Economic Growth
(3) FAI
(4) Total Retail Sales of Consumer Goods
(5) Total Import and Export Volume and the Growth
(6) Money Supply and the Loans
(7) CPI Index
1.4 Analysis of Technology Environment of Integrated Circuit Encapsulation Industry
1.4.1 Evolution Analysis of Integrated Circuit Encapsulation Technologies
1.4.2 Application Fields of Integrated Circuit Encapsulation Forms
1.4.3 Analysis of Process of Integrated Circuit Encapsulation Technology
1.4.4 New Technology Trend of Integrated Circuit Encapsulation Industry
Chapter 2: Analysis of Development of China Integrated Circuit Industry
2.1 Development Situation of Integrated Circuit Industry
2.1.1 Profile of Integrated Circuit Industrial Chain
2.1.2 Analysis of Development Status of Integrated Circuit Industry
(1) Great Development Momentum of the Industry
(2) Fast Promotion of Technological Level in the Industry
(3) Competitiveness of Industry Needs to Be Enhanced
(4) Further Optimization of Industrial Structure
2.1.3 Analysis of Regional Development Pattern of Integrated Circuit Industry
(1) A Three Major Regions-Based Development Pattern Has Been Formed
(2) An Overall Distribution Structure of “One Axe and One Belt” Presented
(3) The Industry Shows a Feature of “Co-existing of Gathering and Separating” and “Some Parts of Industry Shift to the East While Others Shift to the West”
2.1.4 Development Opportunities for Integrated Circuit Industry
(1) Policy Environment of Industry Turns to Be Good
(2) Strategic Emerging Industries Will Accelerate the Development
(3) Capital Market Will Provide More Opportunities for Enterprises’ Financing
2.1.5 Major Problems in Integrated Circuit Industry
(1) Small Size
(2) Not Enough Innovation
(3) Not Enough Integration of Value Chain
(4) Imperfect Industrial Chain
2.1.6 “Twelfth Five-year” Development Forecast for Integrated Circuit Industry
2.2 Development Situation of Integrated Circuit Design Industry
2.2.1 Development Overview of Integrated Circuit Design Industry
2.2.2 Development Features of Integrated Circuit Design Industry
(1) Continuous Expansion of Size of Industry
(2) Increase of Quality but Decrease of Quantity
(3) Continuous Expansion of Size of Enterprise
(4) Significant Boost of Technological Capability
2.2.3 Development Worries of Integrated Circuit Design Industry
2.2.4 New Development Strategies for Integrated Circuit Design Industry
2.2.5 “Twelfth Five-year” Development Forecast for Integrated Circuit Design Industry
2.3 Development Situation of Integrated Circuit Manufacturing Industry
2.3.1 Analysis of Development Status of Integrated Circuit Manufacturing Industry
(1) Development Overview of Integrated Circuit Manufacturing Industry
(2) Major Development Features of Integrated Circuit Manufacturing Industry
(3) Analysis of Size and Fiscal Index of Integrated Circuit Manufacturing Industry
1) Analysis of Size of Integrated Circuit Manufacturing Industry
2) Analysis of Profitability of Integrated Circuit Manufacturing Industry
3) Analysis of Operational Capability of Integrated Circuit Manufacturing Industry
4) Analysis of Debt-paying Ability of Integrated Circuit Manufacturing Industry
5) Analysis of Development Capability of Integrated Circuit Manufacturing Industry
2.3.2 Analysis of Economic Indexes of Integrated Circuit Manufacturing Industry
(1) Major Economic Factors to Impact Integrated Circuit Manufacturing Industry
(2) Analysis of Economic Indexes of Integrated Circuit Manufacturing Industry
(3) Analysis of Proportion Changes of Major Economic Indexes for Enterprises with Different Sizes
(4) Analysis of Proportion Changes of Major Economic Indexes for Enterprises with Different Types of Properties
(5) Analysis of Economic Indexes for Enterprises in Different Regions
2.3.3 Analysis of Balance between Supply and Demand of Integrated Circuit Manufacturing Industry
(1) Analysis of Supply of National Integrated Circuit Manufacturing Industry
1) Analysis of Total Industrial Value of National Integrated Circuit Manufacturing Industry
2) Analysis of Finished Products of National Integrated Circuit Manufacturing Industry
(2) Analysis of Demand of National Integrated Circuit Manufacturing Industry
1) Analysis of Sales Value of National Integrated Circuit Manufacturing Industry
2) Analysis of Sales Revenue of National Integrated Circuit Manufacturing Industry
(3) Analysis of Production and Marketing Ratio of National Integrated Circuit Manufacturing Industry
2.3.4 “Twelfth Five-year” Development Forecast for Integrated Circuit Manufacturing Industry
Chapter 3: Analysis of Development of China Integrated Circuit Encapsulation Industry
3.1 Analysis of Development of Semiconductor Industry
3.1.1 Analysis of Indexes Comparison of Semiconductor Industry
(1) SOXX and Dow Jones Index
(2) Taiwan Electronic Component Index and Taipei Weighted Index
(3) CSRC Electronics Industry Index and CSI 300 Index
3.1.2 Analysis of Production and Marketing of Global Semiconductors
(1) Production of Global Semiconductor
(2) Sales of Global Semiconductor
3.1.3 Major Enterprises in Global Semiconductor Industry
(1) Top 10 in Global Semiconductor
(2) Global Leasing Semiconductors
3.1.4 Development Overview of China Semiconductor Industry
3.1.5 BB Value Analysis of Semiconductor Equipment
3.1.6 Prosperity Forecast for Semiconductor Industry
3.1.7 Development Trend for Semiconductor Industry
(1) Industrial Chain Transforms towards Specialization
(2) Comprehensive Manufacturer towards Light Asset
(3) Gradual Growth of Production Value of Encapsulation Link
(4) Outsourcing of Encapsulation Also Becomes a Trend
3.2 Analysis of Development of Integrated Circuit Encapsulation Industry
3.2.1 Analysis of Size of Integrated Circuit Encapsulation Industry
3.2.2 Analysis of Development Status of Integrated Circuit Encapsulation Industry
3.2.3 Analysis of Profit Level of Integrated Circuit Encapsulation Industry
3.2.4 Technological Comparison between Mainland Manufacturers and Leading Manufacturers in the Industry
3.2.5 Analysis of Factors to Impact Integrated Circuit Encapsulation Industry
(1) Advantages
(2) Disadvantages
3.2.6 Development Trend and Prospects Forecast for Integrated Circuit Encapsulation Industry
(1) Analysis of Development Trend
(2) Prospects Forecast
3.3 Analysis of Patent of Integrated Circuit Encapsulation
3.3.1 Sample Composition of Patent Analysis
(1) Selection of Database
(2) Forms of Search
3.3.2 Analysis of Encapsulation-Based Patents
(1) Annual Trend of Publication of Patent
(2) Comparison between China and Foreign Trend of Publication of Patent
(3) Major Cities Distribution of Publication of Patent in Domestic
(4) Trend Publication of IPC Technology Classification
3.4 Exploration of Some Technical Problems in the Course of Integrated Circuit Encapsulation
3.4.1 Analysis of Causes and Strategies for Cracking of Integrated Circuit Encapsulation
(1) Analysis of Factors to Impact Cracking of Encapsulation
(2) Methods Analysis of Factors of Management and Control to Impact the Cracking
3.4.2 Analysis of Causes and Strategies for Chip Crater Problems
(1) Analysis of Factors to Create Chip Crater Problems
(2) Analysis of Methods for Preventing the Creation of Crater Problems
Chapter 4: Analysis of Market Demand of China Integrated Circuit Encapsulation Industry
4.1 Analysis of Integrated Circuit Market
4.1.1 Market Size of Integrated Circuit
4.1.2 Analysis of Market Structure of Integrated Circuit
(1) Analysis of Product Structure of Integrated Circuit Market
(2) Analysis of Application Structure of Integrated Circuit Market
4.1.3 Competitive Landscape of Integrated Circuit Market
4.1.4 Self-sufficiency Rate of Domestic Integrated Circuit Market
4.1.5 Development Forecast for Integrated Circuit Market
4.2 Analysis of Demand for Integrated Circuit Encapsulation Industry
4.2.1 Analysis of Computer Segment’s Demand for the Industry
(1) Development Status of Computer Market
(2) Application of Integrated Circuit in the Field of Computer
(3) The Pull Effect of Computer Segment on Demand of the Industry
4.2.2 Analysis of Consumer Electronics Segment’s Demand for the Industry
(1) Development Status of Consumer Electronics Market
(2) Application of Integrated Circuit in the Field of Consumer Electronics
(3) The Pull Effect of Consumer Electronics Segment on Demand of the Industry
4.2.3 Analysis of Communication Segment’s Demand for the Industry
(1) Development Status of Communication Market
(2) Application of Integrated Circuit in the Field Communication Segment
(3) The Pull Effect of Communication Segment on Demand of the Industry
4.2.4 Analysis of Industrial Control Equipment Segment’s Demand for the Industry
(1) Development Status of Industrial Control Equipment Market
(2) Application of Integrated Circuit in the Field of Industrial Control Equipment
(3) The Pull Effect of Industrial Control Equipment Segment on Demand of the Industry
4.2.5 Analysis of Car Electronics Segment’s Demand for the Industry
(1) Development Status of Car Electronics Market
(2) Application of Integrated Circuit in the Field of Car Electronics
(3) The Pull Effect of Industrial Control Equipment Segment on Demand of the Industry
4.2.6 Analysis of Other Industries’ Demand for the Industry
Chapter 5: Analysis of Market Competition of China Integrated Circuit Encapsulation Industry
5.1 Analysis of Porter’s Five Force Mode of Competition Structure of Integrated Circuit Encapsulation Industry
5.1.1 Competition among Current Competitors
5.1.2 Analysis of Supplier Bargaining Power for Key Factors
5.1.3 Analysis of Consumer Bargaining Power
5.1.4 Analysis of Potential Entrants in the Industry
5.1.5 Analysis of Substitutes Risks
5.2 Analysis of International Competitive Landscape of Integrated Circuit Encapsulation Industry
5.2.1 Overall Development Situation of International Integrated Circuit Encapsulation Market
5.2.2 Analysis of Competition Situation of International Integrated Circuit Encapsulation Market
5.2.3 Analysis of Development Trend of International Integrated Circuit Encapsulation Market
(1) High Density, High-speed, High Frequency and Low Cost Encapsulation Technologies
(2) Change Trends of Materials Close to the Mainboard
5.2.4 Analysis of Multinationals’ Competitiveness in China’s Market
(1) Analysis of Competitiveness of ASE Group
1) Enterprise Development Profile
2) Analysis of Enterprise Operation Situation
3) Enterprise Main Operational Products and Application Fields
4) Analysis of Enterprise’s Market Regions and Position in the Industry
5) Investment Layout of Enterprise in China’s Market
(2) Analysis of Competitiveness of Amkor Technology, Inc.
1) Enterprise Development Profile
2) Analysis of Enterprise Operation Situation
3) Enterprise Main Operational Products and Application Fields
4) Analysis of Enterprise’s Market Regions and Position in the Industry
5) Investment Layout of Enterprise in China’s Market
(3) Analysis of Competitiveness of Siliconware Precision Industries Co., Ltd.
1) Enterprise Development Profile
2) Analysis of Enterprise Operation Situation
3) Enterprise Main Operational Products and Application Fields
4) Analysis of Enterprise’s Market Regions and Position in the Industry
5) Investment Layout of Enterprise in China’s Market
(4) Analysis of Competitiveness of STATS ChipPAC Ltd.
1) Enterprise Development Profile
2) Analysis of Enterprise Operation Situation
3) Enterprise Main Operational Products and Application Fields
4) Analysis of Enterprise’s Market Regions and Position in the Industry
5) Investment Layout of Enterprise in China’s Market
(5) Analysis of Competitiveness of Powertech Technology Inc.
1) Enterprise Development Profile
2) Analysis of Enterprise Operation Situation
3) Enterprise Main Operational Products and Application Fields
4) Analysis of Enterprise’s Market Regions and Position in the Industry
5) Investment Layout of Enterprise in China’s Market
(6) Analysis of Competitiveness of Freescale Semiconductor, Inc.
1) Enterprise Development Profile
2) Analysis of Enterprise Operation Situation
3) Enterprise Main Operational Products and Application Fields
4) Analysis of Enterprise’s Market Regions and Position in the Industry
5) Investment Layout of Enterprise in China’s Market
(7) Analysis of Competitiveness of Infineon Technologies AG
1) Enterprise Development Profile
2) Analysis of Enterprise Operation Situation
3) Enterprise Main Operational Products and Application Fields
4) Analysis of Enterprise’s Market Regions and Position in the Industry
5) Investment Layout of Enterprise in China’s Market
5.3 Analysis of Domestic Competitive Landscape of Integrated Circuit Encapsulation Industry
5.3.1 Analysis of Competitive Landscape of Domestic Integrated Circuit Encapsulation Industry
5.3.2 Analysis of Concentration Degree of Domestic Integrated Circuit Encapsulation Industry
(1) Analysis of Concentration Degree of Industry Sales Revenue
(2) Analysis of Concentration Degree of Industry Profits
(3) Analysis of Concentration Degree of Total Industrial Output Value
5.3.3 Analysis of International Competitiveness of China Integrated Circuit Encapsulation Industry
Chapter 6: Analysis of Product Market of China Integrated Circuit Encapsulation Industry
6.1 Analysis of BGA Product Market of Integrated Circuit Encapsulation Industry
6.1.1 Level of Encapsulation Technologies for BGA
6.1.2 Major Application Fields of BGA Products
6.1.3 Demand Pull Factors of BGA Products
6.1.4 Analysis of Market Size of BGA Products
6.1.5 Market Prospects Forecast for BGA Products
6.2 Analysis of SIP Product Market of Integrated Circuit Encapsulation Industry
6.2.1 Level of Encapsulation Technologies for SIP
6.2.2 Major Application Fields of SIP Products
6.2.3 Demand Pull Factors of SIP Products
6.2.4 Analysis of Market Size of SIP Products
6.2.5 Market Prospects Forecast for SIP Products
6.3 Analysis of SOP Product Market of Integrated Circuit Encapsulation Industry
6.3.1 Level of Encapsulation Technologies for SOP
6.3.2 Major Application Fields of SOP Products
6.3.3 Market Development Status of SOP Products
6.3.4 Market Prospects Forecast for SOP Products
6.4 Analysis of QFP Product Market of Integrated Circuit Encapsulation Industry
6.4.1 Level of Encapsulation Technologies for QFP
6.4.2 Major Application Fields of QFP Products
6.4.3 Market Development Status of QFP Products
6.4.4 Market Prospects Forecast for QFP Products
6.5 Analysis of QFN Product Market of Integrated Circuit Encapsulation Industry
6.5.1 Level of Encapsulation Technologies for QFN
6.5.2 Major Application Fields of QFN Products
6.5.3 Market Development Status of QFN Products
6.5.4 Market Prospects Forecast for QFN Products
6.6 Analysis of MCM Product Market of Integrated Circuit Encapsulation Industry
6.6.1 Overview of Level of MCM Encapsulation Technologies
(1) Profile of Concept
(2) Classification of MCM Encapsulation
6.6.2 Major Application Fields of MCM Products
6.6.3 Demand Pull Factors of MCM Products
6.6.4 Market Demand Status of MCM Products
6.6.5 Market Prospects Forecast for MCM Products
6.7 Analysis of CSP Product Market of Integrated Circuit Encapsulation Industry
6.7.1 Overview of Level of CSP Encapsulation Technologies
(1) Profile of Concept
(2) Features of CSP Products
(3) Classification of CSP Encapsulation
(4) Process Flow of CSP Encapsulation
6.7.2 Major Application Fields of CSP Products
6.7.3 Market Demand Status of CSP Products
6.7.4 Market Prospects Forecast for CSP Products
6.8 Analysis of Other Product Markets of Integrated Circuit Encapsulation Industry
6.8.1 Analysis of WLP Market
(1) Concept of Profile
(2) Product Features
(3) Major Application Fields
(4) Market Size and Major Suppliers
(5) Prospects Forecast
6.8.2 Analysis of Flip Chip Encapsulation Market
(1) Profile of Concept
(2) Features of Product
(3) Major Application Fields
(4) Prospects Forecast
6.8.3 Analysis of 3D Encapsulation Market
(1) Profile of Concept
(2) Encapsulation Methods
(3) Development Status and Prospects
Chapter 7: Analysis of Operation of Major Enterprises in China Integrated Circuit Encapsulation Industry
7.1 Analysis of Overall Development Situation of Major Enterprises in Integrated Circuit Encapsulation Industry
7.1.1 Total Industrial Output Value Rankings of Manufacturers in Integrated Circuit Encapsulation Industry
7.1.2 Sales Revenue Rankings of Manufacturers in Integrated Circuit Encapsulation Industry
7.1.3 Total Profits Rankings of Manufacturers in Integrated Circuit Encapsulation Industry
7.2 Case Study of Leading Enterprises in Integrated Circuit Encapsulation Industry
7.2.1 Analysis of Freescale Semiconductor, Inc.
(1) Analysis of Enterprise Development Profile
(2) Analysis of Enterprise Production and Marketing Capability
(3) Analysis of Enterprise Profitability
(4) Analysis of Enterprise Operational Capability
(5) Analysis of Enterprise Debt-paying Ability
(6) Analysis of Enterprise Development Capability
(7) Enterprise Product Structure and New Product Trends
(8) Enterprise Sales Channels and Networks
(9) Analysis of Enterprise Operational Advantages and Disadvantages
7.2.2 Analysis of RF Micro Devices, Inc.
(1) Analysis of Enterprise Development Profile
(2) Analysis of Enterprise Production and Marketing Capability
(3) Analysis of Enterprise Profitability
(4) Analysis of Enterprise Operational Capability
(5) Analysis of Enterprise Debt-paying Ability
(6) Analysis of Enterprise Development Capability
(7) Enterprise Product Structure and New Product Trends
(8) Enterprise Sales Channels and Networks
(9) Analysis of Enterprise Operational Advantages and Disadvantages
7.2.3 Analysis of Jiangsu Changjiang Electronics Technology Co., Ltd.
(1) Analysis of Enterprise Development Profile
(2) Analysis of Major Economic Indicators
(3) Analysis of Enterprise Profitability
(4) Analysis of Enterprise Operational Capability
(5) Analysis of Enterprise Debt-paying Ability
China has initially formed three space clusters of integrated circuit industry at present. The clusters are Yangtze River Delta, Bohai-Rim, and Pearl River Delta. The sales revenue of the three clusters accounted for about 95% of the whole integrated circuit industry in 2010. The integrated circuit industry mainly distributes in provincial cities and coastal planning cities, and features as “one axis and one belt”—a development axis along the river which east to Shanghai and west to Chengdu, a coastal industry belt which north to Dalian and South to Shenzhen. And the six major cities are formed: Beijing, Shanghai, Shenzhen, Wuxi, Suzhou and Hangzhou.
The State Council published Circular of the State Council Concerning the Further Encouraging the Development of Software Industry and Integrated Circuit Industry in January 2011. The document provided many supports in the aspects of finance and taxation, investment and financing, R&D, import and export, the talent, and intellectual property. And the range of the policies covers from design corporations and manufacturers to industrial chain up/down-stream corporations like encapsulation, testing, equipment and material. The policy environment for industry development is better and better.
The integrated circuit industry has become an international focus and a significant symbol to measure a country’s comprehensive strength. The output of China’s integrated circuit in 2010 was 65.25 billion pieces and the sales amount was 142.4 billion Yuan. The industry scale has increased from less than 2% of the global integrated circuit industry in 2001 to about 9% in 2010. China was one of the regions with the fast development pace in the aspect of global integrated circuit industry in last decade.
Along with the fast growth of industry scale, the structure of IC design industry, chip manufacturing industry and encapsulation testing industry is improving constantly. The year-on-year growth of domestic IC design industry reached 34.8% while the scale was 36.385 billion Yuan in 2010; the growth of chip manufacturing industry was 31.1% while the scale was 44.712 billion Yuan; the encapsulation testing industry with a relatively low growth which was 26.3% and the scale was 62.918 billion Yuan. In general, the IC design industry and chip manufacturing industry trend to take an annually growing proportion that the proportion was 25.3% and 31% in 2010; the proportion of encapsulation testing industry declined relatively. It was 43.7% in 2010 which still the biggest one comparing with other industries.
China has initially formed three space clusters of integrated circuit industry at present. The clusters are Yangtze River Delta, Bohai-Rim, and Pearl River Delta. The sales revenue of the three clusters accounted for about 95% of the whole integrated circuit industry in 2010. The integrated circuit industry mainly distributes in provincial cities and coastal planning cities, and features as “one axis and one belt”—a development axis along the river which east to Shanghai and west to Chengdu, a coastal industry belt which north to Dalian and South to Shenzhen. And the six major cities are formed: Beijing, Shanghai, Shenzhen, Wuxi, Suzhou and Hangzhou.
According to state planning, the scale of domestic integrated circuit industry will double by 2015 comparing with that in 2010, the sales revenue will exceed 300 billion Yuan, and the products can meet 30% of the domestic market demand. The chip design capability will be greatly improved and a butch of core chips with independent intellectual property will be developed. Furthermore, the encapsulation testing industry will become part of the international mainstream. During the “twelfth five years” China’s integrated circuit industry will enter another new and golden development period.
Qianzhan Business Information Co., Ltd. Industry Research College
Research Team of Integrated Circuit Encapsulation Industry
The National Bureau of Statistics Foreign-related investigation Permission
National Innovation Company and Dual Software Certified Enterprise
The only DRC desginated Enterprise of the Industry Yearbook
National Ministry of Commerce designated Industrial Early Warning and Monitoring Workstation
Guangdong Province Enterprise of Observing Contract and Valuing Credit
Qianzhan is an industry consulting service provider with national innovation company qualification, independent research and development of industrial big data and Dual Software Certification.
Qianzhan is a consulting and research organization that has been engaged in business consulting for over 16 years in China.
Qianzhan is a consulting service provider with a team of nearly 300 industrial researchers and analysts.
Qianzhan is a consulting service provider with an in-house expert pool of 1200 experts.
Qianzhan is a research and consulting organization that have served 180000 clients and received over positive comments from 100000 of our clients.
Qianzhan is an industry research and consulting organization that has been designated by the highest authority, the DRC, to prepare the yearbook.
Qianzhan is an industry planning and consulting organization that adopts the internationally synchronized SCP scientific analysis model and the perfect industry chain research map to guide the business planning and consulting.
Qizhan is a consulting service organization that helps enterprises to solve the five aspects of industry research, planning, strategic design, capital operation and implementation.
Free Hotline：+86 400-068-7188
Customer Hotline：+86 755 - 82925195 / 82925295
Email Address：service@qianzhan.com
3rd Floor, FIYTA Building West, High Tech South Avenue 1, Nanshan District, Shenzhen, China
Location：Rm.1106, Building 1, Jiayu International Plaza, Songhu Road, Yangpu District,
Shanghai, China
Quality Assured
Offer a forward-looking vision to all of our customers.
Customer Service
We welcome any feedbacks and suggestions to make our customers 100% satisfied.
Qualification Certificates
Having more than 20 qualification certificates, including Innovation Company Certificate and Foreign-related investigation Permission etc.
Customers Testimonials
Thank you for recognizing our high quality products and professional, rigorous and sincere service.
